(China (Mainland))
Product Summary
The BCM1101B0KPB is an enterprise IP phone chip. It is the most highly integrated silicon solution for feature enhanced Voice over IP enterprise phones. The BCM1101B0KPB represents the first silicon solution that integrates all the key silicon components of an Ethernet IP Phone into a single device, thereby reducing the overall system cost and complexity of Enterprise IP Phone products, while at the same time increasing their voice quality and the reliability of the network to which they are attached.
Parametrics
BCM1101B0KPB general specifications: (1)0.18μ process technology, 1.8/3.3V; (2)1.1W peak, 0.3–0.8W standby modes; (3)256-pin PBGA package enables 4-layer PCB designs.
Features
BCM1101B0KPB features: (1)150 MHz MIPS32 CPU (165 DMIPS) with 8K I-cache and 4K D-cache; (2)Superscalar 108 MHz ZSP DSP with dual-MAC (216 MIPS), 48K instruction and 32K data RAM; (3)Three-port 10/100BASE-T Ethernet switch with 64K buffer memory; (4)Two 10/100BASE-T Ethernet PHYs with in-line power over Ethernet support ; (5)Three wideband audio ADCs and DACs; (6)9x9 keyscan controller; (7)Ethernet status LED driver; (8)TDM IOM-2 port; (9)Two UARTs; (10)Two high-speed serial ports; (11)General purpose I/O; (12)Interrupt control unit; (13)DMA support unit; (14)SDRAM interface; (15)External bus interface; (16)IEEE 1149.1 (JTAG).
Diagrams
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